高通與多家中國手機廠商聯(lián)合發(fā)布5G領(lǐng)航計劃

Qualcomm has formed a consortium of Chinese smartphone manufacturers to launch superspeed 5G devices as early as next year.

高通(Qualcomm)與中國智能手機制造商組建了一個聯(lián)盟，以求最早于明年推出超高速的5G設(shè)備。

The US chip giant launched its “5G Pioneer” initiative on Thursday on stage in Beijing with the presidents and CEOs of its Chinese smartphone partners, Xiaomi, Oppo, and Vivo, as well as top-level executives from ZTE and Lenovo.

這家美國芯片巨頭周四在北京發(fā)布了“5G領(lǐng)航計劃”(5G Pioneer)，出席發(fā)布會的還有其中國智能手機合作伙伴小米(Xiaomi)、OPPO、vivo的總裁和首席執(zhí)行官們，以及中興(ZTE)和聯(lián)想(Lenovo)的高管們。

Qualcomm also announced a memorandum of understanding with Xiaomi, Lenovo, Oppo, and Vivo to purchase a total of $2bn of Qualcomm components over three years. The components make it easier for mobile phone antennae to be used with 5G connections.

高通還宣布與小米、聯(lián)想、OPPO和vivo達成諒解備忘錄，后面這幾家企業(yè)將在3年內(nèi)合計購買20億美元的高通零部件。這些零部件會讓手機天線更容易被用于5G網(wǎng)絡(luò)。

Qualcomm is cosying up to Chinese partners in the face of troubles in Europe and the US.

在高通于歐洲和美國陷入麻煩之際，該公司正在密切與中國合作伙伴的關(guān)系。

Yesterday European regulators hit Qualcomm with a €997m fine for abusing its market dominance.

昨日，歐洲監(jiān)管機構(gòu)以高通濫用市場主導(dǎo)地位為由對其罰款9.97億歐元。

For the past year, the company has been locked in numerous court battles with its major client Apple, which could end in the iPhone maker leaving Qualcomm’s chips out of its next handset, according to people familiar with the matter.

據(jù)知情人士透露，過去一年，高通與其主要客戶蘋果(Apple)多次對簿公堂，這可能導(dǎo)致蘋果不再在其下一代手機中采用高通的芯片。